Ultraviolet Reflective Rough Adhesive Contact

ABSTRACT

A device including a first semiconductor layer and a contact to the first semiconductor layer is disclosed. An interface between the first semiconductor layer and the contact includes a first roughness profile having a characteristic height and a characteristic width. The characteristic height can correspond to an average vertical distance between crests and adjacent valleys in the first roughness profile. The characteristic width can correspond to an average lateral distance between the crests and adjacent valleys in the first roughness profile.

REFERENCE TO RELATED APPLICATIONS

The current application is a continuation-in-part application of U.S.application Ser. No. 14/150,949, which was filed on 9 Jan. 2014, whichclaims the benefit of U.S. Provisional Application No. 61/750,452,titled “Ultraviolet Light Emitting Diode with Rough Reflective AdhesiveContact,” which was filed on 9 Jan. 2013, both of which are herebyincorporated by reference.

TECHNICAL FIELD

The disclosure relates generally to contacts for semiconductors, andmore particularly, to an ultraviolet reflective rough adhesive contact.

BACKGROUND ART

Group III nitride semiconductors are widely used for efficient blue andultraviolet light emitting diodes, lasers, ultraviolet detectors, andfield effect transistors. Due to a wide band-gap, group III nitridesemiconductor materials are one of the prime choices for deepultraviolet light emitting diodes (DUV LEDs). While there has been muchadvancement in improving the efficiency of DUV LEDs, the overallefficiency of these devices remains low. The wide band-gap of group IIInitride semiconductor materials makes it difficult to form a good ohmiccontact to the semiconductor layers. This can lead to resistive lossesat the contact junction.

DUV LED devices frequently employ flip-chip technology in order tocontrol light extraction and thermal management of DUV LED devices. Forexample, FIG. 1 illustrates a typical design of a flip-chip LED 2according to the prior art. For flip-chip LEDs to have a highefficiency, it is desirable for the p-type contact 6 and the n-typecontact 8 to be both ohmic and reflective, which allows each contact 6,8 to serve as an electrode as well as a mirror for reflecting lightemitted by an active region 4 out of the device 2. Additionally, it isdesirable for the contacts 6, 8 to have stability during thermal cyclingthat occurs while packaging, as well as during operation of the device.Aluminum is a good reflecting metal, however, aluminum does not produceohmic contact and is unstable during packaging.

Several types of metallic contacts have been proposed to improve ohmiccontact to semiconductor layers. These contacts are formed of, forexample: nickel/gold (Ni/Au), cobalt/gold (Co/Au), palladium/gold(Pd/Au), rhodium (Rh)-based, palladium/platinum/gold (Pd/Pt/Au),Pt/Ni/Au, Ni/Pt/Au, Ni/Pd/Au, and titanium/platinum/gold (Ti/Pt/Au)metallic layers. The thermal stability of Pd/Ni contacts is enhanced dueto the formation of Pd gallides. Additionally, Pd/Ni contacts can leadto a reduction of contact resistivity. For Ni-based contacts, the Ni iseasily oxidized above 400 degrees Celsius and the ohmic contact becomesworse at temperatures above 500 degrees Celsius.

One approach proposed a Pd/Ni/Al/Ti/Au metallization scheme for acontact with layers having corresponding thicknesses of 3 nm/2 nm/150nm/20 nm/30 nm. This contact exhibited good thermal stability andreflectivity of sixty-two percent for radiation having a wavelength of370 nm at normal incidence and good ohmic characteristics afterannealing at three hundred degrees Celsius in nitrogen gas (N₂). It isfurther noted that the combination of Pd and Ni results in a good ohmiccontact, while a contact without the presence of Ni results in largerresistance and non-linear behavior.

Most attempts at contact engineering have been for visible LEDs or nearultraviolet (UV) LEDs. For example, one approach found good ohmicproperties for an iridium/silver (Ir/Ag) p-type contact with aseventy-five percent reflectivity for radiation with a wavelength of 405nm. At the same wavelength, an indium-doped zinc oxide/silver (ZnO/Ag)contact has a reflectivity of 82.3%.

Other attempts at contact engineering for radiation near UV wavelengthshave been proposed. For example, one approach proposed a nickel (Ni)“cleaning” mechanism. Residual oxide on the Gallium Nitride (GaN)surface was removed by Ni deposition and subsequent annealing. Thisresulted in better ohmic contact properties. Another approach proposedindium tin oxide (ITO) and zinc oxide (ZnO) contacts, instead ofmetallic contacts. However, for UV LEDs, different contacts are requiredin order to result in highly reflective UV mirrors.

The current application incorporates by reference U.S. ProvisionalApplication No. 61/569,416 titled “Ultraviolet Reflective Contact,”which was filed on 12 Dec. 2011. This provisional application outlines acontact that comprises at least two or more original sublayers which maycomprise an ohmic sublayer, ohmic protection sublayer, reflectivesublayer, reflector protective sublayer, conductive electrode sublayerand a final layer being dielectric adhesion layer. In addition to ametallic sublayer structure of the contact, the p-type group IIIsemiconductor material also may contain a sublayered structure that maycontain a thin layer of p-type GaN in the vicinity of the p-type contacttogether with a graded GaN—AlGaN region. Furthermore, a thin layer ofIn_(x)Al_(y)Ga_(1-x-y)N layer may be included in the vicinity of thep-type contact. The provisional application also considers thepossibility of a contact having an inhomogeneous structure in a lateraldirection, both in the metallic layers as well as composition in theunderlying group III semiconductor layers.

SUMMARY OF THE INVENTION

The inventors have found that the above-described contacts to asemiconductor layer, such as a p-type group III-V semiconductor layer,can be improved. For example, a p-type contact for a group III-nitridebased DUV LED can be improved to increase light extraction efficiency,while maintaining a low electrical resistance and a good contactadhesion between the contact and the semiconductor layer.

Aspects of the invention provide a device including a firstsemiconductor layer and a contact to the first semiconductor layer. Aninterface between the first semiconductor layer and the contact includesa first roughness profile having a characteristic height and acharacteristic width. The characteristic height can correspond to anaverage vertical distance between crests and adjacent valleys in thefirst roughness profile. The characteristic width can correspond to anaverage lateral distance between the crests and adjacent valleys in thefirst roughness profile.

A first aspect of the invention provides a device comprising: a firstsemiconductor layer; and a contact to the first semiconductor layer,wherein an interface between the first semiconductor layer and thecontact includes a first roughness profile having a characteristicheight of at least three nanometers and a characteristic width of atleast 0.1 micron.

A second aspect of the invention provides a device comprising: a firstsemiconductor layer; and a contact to the first semiconductor layer,wherein an interface between the first semiconductor layer and thecontact includes a first roughness profile with a characteristic heightand a characteristic width, wherein the characteristic height is anaverage vertical distance between adjacent crests and valleys of thefirst roughness profile, and is at least approximately three nanometers,and wherein the characteristic width is an average lateral distancebetween adjacent crests and valleys of the first roughness profile, andis within a range of approximately 0.1 micron to approximately fiftymicrons.

A third aspect of the invention provides a method comprising:fabricating a device, the device comprising: a first semiconductorlayer; and a contact to the first semiconductor layer, wherein aninterface between the first semiconductor layer and the contact includesa first roughness profile having a characteristic height of at leastthree nanometers and a characteristic width of at least 0.1 micron.

The illustrative aspects of the invention are designed to solve one ormore of the problems herein described and/or one or more other problemsnot discussed.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of the disclosure will be more readilyunderstood from the following detailed description of the variousaspects of the invention taken in conjunction with the accompanyingdrawings that depict various aspects of the invention.

FIG. 1 shows a typical design of a flip-chip LED according to the priorart.

FIGS. 2A-2B show portions of an illustrative device structure accordingto embodiments.

FIG. 3 shows a portion of an illustrative device structure according toan embodiment.

FIG. 4 shows a portion of an illustrative device structure according toan embodiment.

FIG. 5 shows a portion of an illustrative device structure according toan embodiment.

FIG. 6 shows a portion of an illustrative device structure according toan embodiment.

FIGS. 7A-7B show portions of illustrative device structures according toembodiments.

FIGS. 8A-8B show portions of illustrative device structures according toembodiments.

FIGS. 9A-9B show portions of illustrative device structures according toembodiments.

FIG. 10 shows a portion of an illustrative device structure according toan embodiment.

FIG. 11 shows illustrative current spreading lines at an interfacebetween a contact and a semiconductor layer according to an embodiment.

FIG. 12 shows a portion of an illustrative device structure according toan embodiment.

FIGS. 13A-13C show illustrative device structures according toembodiments.

FIGS. 14A-14C show illustrative periodic roughness profiles in twolateral directions according to embodiments.

FIG. 15 shows an illustrative mesa region of a semiconductor structureaccording to an embodiment.

FIG. 16 an illustrative flow diagram for fabricating a circuit accordingto an embodiment.

It is noted that the drawings may not be to scale. The drawings areintended to depict only typical aspects of the invention, and thereforeshould not be considered as limiting the scope of the invention. In thedrawings, like numbering represents like elements between the drawings.

DETAILED DESCRIPTION OF THE INVENTION

As indicated above, aspects of the invention provide a device includinga first semiconductor layer and a contact to the first semiconductorlayer. An interface between the first semiconductor layer and thecontact includes a first roughness profile having a characteristicheight and a characteristic width. The characteristic height cancorrespond to an average vertical distance between crests and adjacentvalleys in the first roughness profile. The characteristic width cancorrespond to an average lateral distance between the crests andadjacent valleys in the first roughness profile. As used herein, unlessotherwise noted, the term “set” means one or more (i.e., at least one)and the phrase “any solution” means any now known or later developedsolution.

Furthermore, it is understood that a contact formed between two layersis considered “ohmic” or “conducting” when an overall resistance of thecontact is no larger than the larger of the following two resistances: acontact resistance such that a voltage drop at the contact-semiconductorjunction is no larger than two volts; and a contact resistance at leastfive times smaller than a resistance of a largest resistive element orlayer of a device including the contact. In an embodiment, the largestresistive element is an active region of the corresponding device (e.g.,a resistance of the active region 4 of the LED shown in FIG. 1). As usedherein, a layer/material is considered “transparent” if it allows atleast approximately ten percent of electromagnetic radiation in acorresponding range of radiation wavelengths to pass there through.Similarly, a layer/material is considered “reflective” if it reflects atleast approximately ten percent of electromagnetic radiation in acorresponding range of radiation wavelengths.

Turning to the drawings, FIG. 2A shows an illustrative portion of adevice 10 according to an embodiment. The device 10 includes a contact12 and a semiconductor layer 14. The contact 12 can be implemented as ap-type or n-type contact for any type of semiconductor device 10. Thecontact 12 can include a plurality of metallic layers, a plurality ofoxide layers, a plurality of nitride layers, and/or the like. In anembodiment, the contact 12 is implemented on a device 10 configured tooperate as a light emitting device, such as a conventional or superluminescent light emitting diode (LED), a laser diode (LD), and/or thelike. For example, the contact 12 can be formed on a flip-chip LED,which is configured similar to the LED 2 (FIG. 1), e.g., in place of oneor both of the contacts 6, 8 shown thereon. However, it is understoodthat a flip-chip LED is only illustrative of various types ofsemiconductor devices for which one or more of the contacts 12 can beutilized.

While aspects of the invention are generally shown and described hereinwith respect to improving extraction of light from an emitting device,it is understood that aspects of the invention further provide variousalternative embodiments. For example, aspects of the invention can beimplemented to facilitate the transmission of light within the device,e.g., as part of optical pumping of a laser light generating structure,excitation of a carrier gas using a laser pulse, and/or the like.Similarly, an embodiment of the invention can be implemented inconjunction with a sensing device, such as a photosensor or aphotodetector. In each case, a contact described herein can be includedin order to facilitate the reflection of light in a desired direction.

The electromagnetic radiation emitted or sensed by a device including acontact described herein can comprise a peak wavelength within any rangeof wavelengths, including visible light, ultraviolet radiation, infraredlight, and/or the like. In an embodiment, the device is configured togenerate and/or sense radiation having a peak wavelength in theultraviolet spectrum (e.g., an ultraviolet device). In a more particularembodiment, the ultraviolet device is configured to emit and/or detectradiation having a peak wavelength in the deep ultraviolet radiationspectrum.

In an embodiment, the emitting or sensing device is a group III-Vmaterials based device, in which some or all of the various layers areformed of elements selected from the group III-V materials system. In amore particular illustrative embodiment, the various layers of thedevice are formed of group III nitride based materials. Group IIInitride materials comprise one or more group III elements (e.g., boron(B), aluminum (Al), gallium (Ga), and indium (In)) and nitrogen (N),such that B_(W)Al_(X)Ga_(Y)In_(Z)N, where 0≦W, X, Y, Z≦1, and W+X+Y+Z=1.Illustrative group III nitride materials include binary, ternary andquaternary alloys such as, AlN, GaN, InN, BN, AlGaN, AlInN, AlBN,AlGaInN, AlGaBN, AlInBN, and AlGaInBN with any molar fraction of groupIII elements.

The contact 12 can be to any of various types of semiconductor layers14, including: an Al_(x)In_(y)B_(z)Ga_(1-x-y-z)N semiconductor layer 14;a p-type semiconductor layer 14 comprising at least one of: titaniumdoped indium oxide, nickel oxide, cobalt oxide, vanadium nitride,chromium nitride, or Me₂(AlGaN), where Me is selected from the group ofelements consisting of: Ag, Pd, Ni, Co, or Pt; a n-type semiconductorlayer 14 comprising at least one of: titanium doped indium oxide, nickeloxide, titanium nitride, tantalum nitride, zirconium nitride, hafniumnitride, or Me₂(AlGaN), where Me is selected from the group of elementsconsisting of: Zr, Hf, V, Nb, W, Mo, Cr, Ti, or Ta; and/or the like.

In any event, an interface 16 between the contact 12 and thesemiconductor layer 14 can include a roughness profile 19. Although theroughness profile 19 is shown as a smooth periodic waveform, it isunderstood that this is only illustrative. For example, the roughnessprofile 19 can be an aperiodic; can include any waveform shape, such asa square, a triangle, a sawtooth, and/or the like; etc. To this extent,FIG. 2B shows a close up view of a portion of an illustrative interface16B. As illustrated, the interface 16B can include stepped portions ofthe semiconductor layer 14B and a plurality of islands 12B of a metal ofthe contact 12.

Returning to FIG. 2A, the roughness profile 19 for the interface 16 canbe configured to increase a surface area between the metallic contact 12and the semiconductor layer 14, which can promote metal-to-semiconductorcontact. The increase in surface area between the contact 12 and thesemiconductor layer 14 decreases the contact resistance and improvesadhesion between the contact 12 and the semiconductor layer 14. Theroughness profile 19 at the interface 16 can also improve adhesion ofthe contact 12 to the semiconductor layer 14. Furthermore, the roughnessprofile can promote light scattering, which decreases wave guiding oflight though the LED structure 10. A characteristic height “H” for theroughness profile 19 can be calculated as an average vertical distancebetween adjacent crests and valleys of the roughness profile. Acharacteristic width “W” for the roughness profile 19 can be calculatedas an average lateral distance between adjacent crests and valleys ofthe roughness profile. In an embodiment, the characteristic height “H”is at least approximately three nanometers, while the characteristicwidth “W” is at least approximately 0.1 micron. In a more specificembodiment, the characteristic width “W” is within a range ofapproximately one micron to approximately fifty microns. In anembodiment, the value of the characteristic width “W” is selected to beon the order of or less than a thickness of the characteristic length ofthe current spreading in the structure to which the contact 12 is made.In a more specific embodiment, the characteristic height “H” is between3 and 20 nanometers. The characteristic height “H” can be selected to beon the order or less than approximately ten percent of a thickness ofthe semiconductor layer 14, which can ensure that the semiconductorlayer 14 behaves as a single layer.

In an embodiment, the interface 16 between the contact 12 and thesemiconductor layer 14 can include multiple roughness profiles ofdifferent scales. Each roughness profile can be configured based on atarget function using any solution. For example, FIG. 3 shows a portionof an illustrative device 30 according to an embodiment. The interface16 includes a first roughness profile 19A and a second roughness profile19B. The first roughness profile 19A and the second roughness profile19B have distinct scales from one another. For example, the secondroughness profile 19B can have a characteristic width that is at leastapproximately five times smaller than the characteristic width of thefirst roughness profile 19A. In this case, the second roughness profile19B can be used to target efficient light scattering, while the firstroughness profile 19A can be used to improve contact-to-semiconductoradhesion and conductivity. Furthermore, the first roughness profile 19Acan be used to improve reflectivity and/or scattering of the light,while the second roughness profile 19B can be used to target an improvedconductivity.

The roughness profiles 19A, 19B can be fabricated using any combinationof deposition and/or etching. For example, the fabrication can includeselective deposition and/or etching of nanoscale objects, such asnanodots and/or nanorods, of the material to form the large and/or smallroughness components described herein. Such deposition and/or etchingcan be used to form periodic and/or non-periodic random patterns.Furthermore, the geometrical and/or optical roughness of each roughnessprofile can be formed by at least one of: standard photolithography,holographic photolithography, or a process that forms self-associatedclusters of a composite layer via dry or wet etching. In an embodiment,a thin layer can be deposited over the semiconductor layer 14 withgrowth conditions that enhance three-dimensional growth and nucleiformation, such as a large aluminum composition (e.g., greater thanapproximately twenty percent), a lower growth temperature (e.g., lessthan one thousand Celsius), and a higher V-III ratio (e.g., greater thanfive thousand).

FIG. 4 shows an illustrative portion of a device 40 according to anotherembodiment. In this case, the interface 16 between the contact 12 andthe semiconductor layer 14 is shown including an interlayer 17. In anembodiment, the interlayer 17 includes a plurality of different types ofislands 18A, 18B. Each island 18A, 18B can have any shape and/or size.The plurality of types of islands 18A, 18B can include islands formedof: a conducting material, such as a metal-based alloy, includingcobalt, aluminum, and/or the like; an oxide, including indium tin oxide(ITO); a nitride; and/or the like. In an embodiment, the plurality ofislands 18A, 18B can also include graphene islands. Some or all of theplurality of islands 18A, 18B in the interlayer 17 can be configured todecrease contact resistance between the contact 12 and the firstsemiconductor layer 14. It is understood that the interlayer 17 caninclude any number of types of islands 18A, 18B. For example, theinterlayer 17 can include a first type of island 18A and a second typeof island 18B.

In an embodiment, the first type of island 18A can include a metal-basedalloy having a high adhesion to the semiconductor layer 14. For example,the high adhesion materials for the first type of island 18A can bemetallic alloys having a work function higher than 4.5 eV, such ascobalt (Co), titanium, (Ti), gallium nitride (GaN), and/or the like. Inan embodiment, the metals have a high adhesion to a semiconductor layer14 comprising AlGaN with a content of gallium that is at leastapproximately forty percent. The second type of islands 18B can beformed of metals that result in a low specific resistance contact to thesemiconductor layer 14 (e.g., good ohmic contact between the contact 12and the semiconductor layer 14). In an embodiment, the resistance islower than 10⁻⁴ ohm*cm². For example, illustrative materials for thesecond type of islands 18B include nickel (Ni), platinum (Pt), palladium(Pd), and/or the like. As shown in FIG. 5, the interlayer 17 can alsoinclude islands 18C of still another type. For example, the islands 18Ccan comprise graphene islands 18C, which can be included to decrease alateral resistance between the metallic islands 18A, 18B.

In an embodiment, the interlayer 17 is sufficiently thin to promote theformation of metallic islands 18A-18C, rather than connected region(s).The interlayer 17 also can serve as a thin contact and/or adhesivelayer, which does not significantly alter the light reflectivecharacteristics of the device 40 that are mainly controlled by thecontact 12. To this extent, as seen in FIG. 6, a thickness “h” of theinterlayer 17, e.g., as measured by the characteristic thickness of theislands 18 forming the interlayer 17, can be smaller than thecharacteristic height “H” of the roughness profile 19.

Turning now to illustrative portions of devices 40A, 40B shown in FIGS.7A-7B, a second semiconductor layer 15 can be located between thecontact 12 and the first semiconductor layer 14. The secondsemiconductor layer 15 can be configured to, for example, promote ohmiccontact between the contact 12 and the first semiconductor layer 14. Inan embodiment, the first semiconductor layer 14 can be formed of amaterial at least fifty percent transparent to a radiation having atarget wavelength and the second semiconductor layer 15 can be a highlyp-doped semiconductor material. For example, the second semiconductorlayer 15 can be a thin layer of highly doped gallium nitride (GaN), alayer with low aluminum content, and/or the like. In one embodiment, thesecond semiconductor layer 15 can be Al_(x)In_(y)Ga_(1-x-y)N, where thegallium content (1-x-y) is greater than 0.8. As shown in FIG. 7A, thesecond semiconductor layer 15 can be laterally homogenous.

However, in another embodiment shown in FIG. 7B, the secondsemiconductor can be laterally inhomogeneous. For example, the secondsemiconductor can include distinct lateral regions 15A, 15B providinginhomogeneous conductive and/or transparent properties in the lateraldirection of the second semiconductor. The second semiconductor caninclude a first plurality of regions of high conductivity 15A, and asecond plurality of regions 15B that are partially transparent. Theregions of high conductivity 15A are measured by an amount of voltagedrop across through the second semiconductor regions 15A. In anembodiment, the first regions 15A includes a total voltage drop that isless than twenty percent of a total operational voltage of the device40B. The second region 15B can be at least approximately ten percenttransparent to radiation having a target wavelength. The inhomogeneoussecond semiconductor can be formed using any solution, e.g., bysemiconductor patterning, and/or the like.

An interlayer 17 can be located between the second semiconductor layer15 and the contact 12. As shown in FIGS. 8A-8B, the interlayer 17 can belocated adjacent to a laterally homogenous second semiconductor layer 15as shown in FIG. 8A, or adjacent to a laterally inhomogeneous secondsemiconductor layer, including a first region 15A and a second region15B as shown in FIG. 8B. The interlayer 17 can be formed through, forexample, semiconductor patterning, and/or the like. Turning now to FIG.9A, the patterning of the interlayer 17 and the second semiconductorlayer 15 can be correlated, so that regions of high conductivity in thesecond semiconductor layer (e.g., 15A) coincide with regions of highconductivity 22A in the interlayer 17. Furthermore, the regions of hightransparency for the second semiconductor layer (e.g., 15B) can coincidewith the regions of high adhesion 22B in the interlayer 17.Alternatively, as shown in FIG. 9B, the regions of high conductivity 15Amay not coincide with regions of high conductivity 22A in the interlayer17, and the regions of high transparency 15B may not coincide with theregions of high adhesion 22B in the interlayer 17.

Formation of the interlayer 17 and a laterally inhomogeneous secondsemiconductor layer can be performed using any solution. In anembodiment, the patterning process for forming the laterallyinhomogeneous interlayer 17 and the laterally inhomogeneous secondsemiconductor begins with depositing a mask onto a surface of thesemiconductor layer 14. The unmasked portions of the semiconductor layer14 can be etched to a particular depth, and a second semiconductormaterial is regrown in the etched regions (e.g., forming secondsemiconductor 15). The regrown semiconductor material can differ fromthe semiconductor material of the semiconductor layer 14 by at least oneof: a composition, a doping, or a V-III ratio. This forms the laterallyinhomogeneous second semiconductor 15.

The interlayer 17 (including at least one of: a metal, an oxide, and/orgraphene) can be deposited over the second semiconductor 15. Theinterlayer 17 can be deposited by means of thermal evaporation,magnetron sputtering, ion-beam deposition, laser beam evaporation,and/or the like. Another mask can be applied over the interlayer 17 andthe unmasked portions of the interlayer 17 can be etched. In anembodiment, the second mask is patterned to etch regions similar to thefirst mask (e.g., so that the patterning of interlayer 17 correlates tothe patterning of the second semiconductor 15). In an alternativeembodiment, the second mark is patterned to etch regions dissimilar tothe first mask, so that these regions may or may not coincide.Subsequently, a new interlayer material can be deposited into the etchedregions. The new interlayer material differs from the first interlayermaterial by electrical and/or optical properties. For example, the firstinterlayer material can be Co, while the second interlayer materialdeposited into the etched regions is Ni or Pd. This forms the laterallyinhomogeneous interlayer 17.

Once the second semiconductor 15 and the interlayer 17 are patterned andformed, the contact 12 is formed over the interlayer 17. Forming thecontact 12 can include depositing a metallic layer over the interlayer17. In an embodiment, the interlayer 17 and/or underlying semiconductorlayer 14 are etched using the metallic layer as a mask, and a reflectivematerial can be deposited into the etched regions. In this case, themetallic layer and the reflective material form the contact 12.

Additional layers can be deposited if the contact 12 includes aplurality of sub-layers. For example, FIG. 10 shows a portion of anillustrative device 60 according to an embodiment. The device 60includes a contact 12 with a plurality of sub-layers 13A, 13B, 13C. Eachsub-layer can be formed of a material configured to provide a specificfunction. A first sub-layer 13A can be protective and can be formed of,for example, rhodium (Rh), palladium (Pd), platinum (Pt), iridium (Ir),and/or the like. A second sub-layer 13B can be highly reflective toradiation having a target wavelength and can be formed of, for example,aluminum (Al), rhodium (Rh), and/or the like. A third sub-layer 13C cancomprise a material that has a low resistance and high heat conductivityand can be formed of, for example, gold (Au), titanium (Ti), nickel(Ni), molybdenum (Mo), and/or the like. Although the contact 12including a plurality of sub-layers 13A, 13B, 13C is shown in FIG. 10 inconjunction with the embodiment including the second semiconductor 15,it is understood that a contact 12 including a plurality of sub-layers13A, 13B, 13C is applicable to any of the embodiments of an interfacediscussed herein. Furthermore, the contact 12 can include any number ofsub-layers.

One or more attributes of a roughness of the interface between themetallic contact 12 and the semiconductor layer 14 (or secondsemiconductor layer 15, if present) can be selected and configured topromote adhesion between the layers. The selection of roughnessattributes to improve adhesion is dependent on the type of semiconductormateriel forming the semiconductor layer 14 and the type of metal at theinterface with the semiconductor layer 14. In general, roughness can beimproved by introducing some roughness, e.g., through etching or byselecting appropriate epitaxial growth conditions of the semiconductorlayer 14. In an embodiment, a height of the roughness, which can bemeasured as an average peak/valley distance, is less than approximatelytwenty nanometers.

For a contact 12 including a plurality of sub-layers 13A-13C, a firstmetallic sub-layer 13A of the contact 12 can have a thickness of atleast one half of the height of the roughness. Furthermore, the entirecontact 12 can be at least as thick as the height of the roughness.Formation of a metallic contact 12 to a p-type GaN semiconductor layercan include annealing the contact 12 at a temperature in a range of 450to 600 Celsius, which provides good conductivity and adhesion.

The morphology of an interlayer 17 including metallic islands 18 can becontrolled through annealing and the selection of metallic sub-layers.As used herein, the morphology of the interlayer 17 refers to thecharacteristic sizes of the resulting annealed islands. Inclusion of theinterlayer 17 also can affect adhesion of the contact 12. For example,in an embodiment, a nickel metallic layer (e.g., islands 18) is used atthe metal contact/semiconductor interface followed by a gold metalliclayer (e.g., sub-layer 13A). Adhesion of the metal contact 12 to thesemiconductor 14 can be measured using any standard adhesion testincluding, for example, the scotch tape test, ninety degree peel test,scratch test, and the like. Furthermore, the die shear test can be usedto evaluate contact adhesion to the die.

Roughness also can be configured based on current spreading. Forexample, FIG. 11 shows illustrative current spreading lines 80 at aninterface 16 between a contact 12 and a semiconductor layer 14 accordingto an embodiment. As illustrated, the current spreads a distance L_(s),which is comparable to a thickness of the semiconductor layer H_(s). Inan embodiment, the roughness profile 19 of the interface 16 includes twoscales, where a first scale is configured based on current spreading andthe second scale is configured for adhesion. In a more specificembodiment, the first scale can have a characteristic width in a rangeof 10% to 1000% of the thickness of the semiconductor layer H_(s). Thesecond scale can be determined using an adhesion test. For example,several different roughness scale samples can be evaluated for thesecond scale, and a target scale can be selected based results of theevaluation.

In an embodiment, the semiconductor layer can include a plurality ofsub-layers. FIG. 12 shows an illustrative device structure 90 accordingto an embodiment. In this embodiment, the device structure 90 includes afirst semiconductor sub-layer 14A and a second semiconductor sub-layer14B. Although only two semiconductor sub-layers are shown, it isunderstood that the device structure 90 can include any number ofsemiconductor sub-layers. The semiconductor sub-layers 14A, 14B can havevariable composition from one another. For example, the firstsemiconductor sub-layer 14A can include an aluminum gallium nitridecomposition having a high molar fraction of aluminum nitride (e.g., amolar fraction in the range of approximately 0.4 to approximately 0.9)and the second semiconductor sub-layer 14B can include an aluminumgallium nitride composition having a higher molar fraction of galliumnitride (e.g., a molar fraction in the range of approximately 0.5 toapproximately 1). In an embodiment, this variable composition betweenthe sub-layers 14A, 14B can form a 2D gas at the interface between thesub-layers 14A, 14B. There can also be a roughness profile 21 at aninterface between the first semiconductor sub-layer 14A and the secondsemiconductor sub-layer 14B. This roughness profile 21 allows for thediffusion of the 2D gas into the sub-layers 14A, 14B. In an embodiment,it is understood that the semiconductor layer 14A can have a highcomposition of gallium nitride and that the semiconductor layer 14B canhave a higher composition of aluminum nitride. In such an embodiment,the semiconductor layer 14B can have an aluminum nitride molar fractionin the range of approximately 0.1 to approximately 0.4 and thesemiconductor layer 14A can have a gallium nitride molar fraction in therange of approximately 0.5 to approximately 1. The interlayer 17 can bedesigned to improve diffusion of the metallic contact 12 into one orboth of the semiconductor sub-layers 14A, 14B. For example, theinterlayer 17 can incorporate the plurality of islands 18A, 18B to theroughness profile 19 of the interlayer 17, the interlayer 17 can beetched to further control the degree of roughness of the roughnessprofile 19 at several length scales, and/or the like.

During formation of the interlayer 17 in the device structure 90, theinterlayer 17 can be annealed to form a plurality of protrusions 23 thatextend from the interlayer 17 into the first semiconductor sub-layer 14Aand/or the first semiconductor sub-layer 14A and the secondsemiconductor sub-layer 14B to improve the contact 12 for thesemiconductor layers 14A, 14B. The annealing can also create a set ofsharp edges 25 on each of the protrusions 23. The plurality ofprotrusions 23 can electrically contact the 2D gas at the interfacebetween the sub-layers 14A, 14B. The annealing can be performed betweenapproximately 400 degrees Celsius to approximately 700 degrees Celsius.

In an embodiment, the roughness at any interface (e.g., roughnessprofile 19, 21) can be configured to have a periodic structure. In amore specific embodiment, a roughness profile 19, 21 can form a photoniccrystal. Turning now to FIGS. 13A-13C, illustrative device structures1000, 1100, 1200 according to embodiments are shown. Periodic roughnessalong any interface within the device structures 1000, 1100, 1200 can beachieved, for example, by patterning and overgrowth, and/or the like.The layers can contain multiple roughness surfaces, with differentlength scales and specific alignments with adjacent layers. In anembodiment, the roughness of a layer does not have to be strictlyperiodic. That is, the layer does not have to have a clearly definedaverage periodic length scale. In another embodiment, the variance ofthe length scale for a roughness of a layer is at most 50% larger thanthe length scale. In FIG. 13A, the plurality of layers 1010, 1020, 1030,1040, 1050 in the device structure 1000 each include a roughness profileat an interface with an adjacent layer. In particular, layers 1020,1030, 1040 include a roughness profile at the top and the bottomsurfaces of the layer. The top and bottom surface of these layers 1020,1030, 1040 can be designed to have a roughness profile that is out ofphase with the roughness profile of an adjacent layer with the sameperiod. In another embodiment, shown in FIG. 13B, the plurality oflayers 1120, 1130, 1140 can include top and bottom surfaces are designedto have a roughness profile that is in phase with the roughness profileof an adjacent layer with the same period. In another embodiment, shownin FIG. 13C, the top surfaces of each of the layers 1210, 1220, 1230,1240, 1250, 1260 can be different from the bottom surfaces. Although itis not shown, it is understood that other configurations are possible.For example, the top and bottom surfaces of a layer can have a differentperiodicity, a different phase, and/or the like. In FIG. 13C, somesurfaces (e.g., top surfaces of layers 1220, 1240, 1260 and bottomsurfaces of layers 1210, 1230, 1250) can be flat. The variation in theroughness profiles at the interfaces between any of the layers in thedevice structures 1000, 1100, 1200 can be configured to improve thecontact characteristics of the device due to increase surface areabetween the metallic and semiconductor layers. Furthermore, thevariation in roughness profiles can be configured to improve opticalproperties of the device for embodiments when the structure is used as apart of the light emitting and light absorbing device at a particularwavelength. For example, the roughness profiles can be designed toimprove scattering of a particular wavelength from the surface.

Turning now to FIGS. 14A-14C, illustrative periodic surface variationsin two lateral directions according to embodiments is shown. Thesefigures show that the roughness profiles can extend in two dimensions.It is important that roughness can be designed to be variable throughthe lateral area of a device. For example, FIG. 14A shows a periodicsine-like roughness profile in two dimensions. In another embodiment,FIGS. 14B and 14C show that the roughness can be different in the centerof the device as compared to the roughness at the edges of the device.In an embodiment, the difference between the roughness at the center ofthe device and the roughness at the edges of the device is at least 10%.This variation from the center of the device to the edges of the devicecan be configured, for example, to improve contact characteristics,modify the properties of the emitted light from the device, and/or thelike.

For light emitting devices containing a mesa region, such as a mesaregion 1300 shown in FIG. 15, the mesa region 1300 can be designed toinclude a sloped surface 1310. The mesa region 1300 can include aplurality of active or superlattice layers 1312. A contact (e.g., ap-type contact) 1320 can be applied to the sloped surface 1310 of themesa region 1300. The contact 1320 can include any of the features inthe embodiments described herein. The sloped surface 1310 of the mesaregion 1300 can include a roughness profile due to the sloped nature ofthe surface. In another embodiment, the sloped surface 1310 can includea roughness profile (in addition to the sloped nature) that isfabricated through etching, patterning combined with overgrowth, and/orthe like. This roughness profile can include a periodic or aperiodicstructure, as described with the embodiments provided herein. Thecontact 1320 at the sloped surface 1310 of the mesa region 1300 allowsfor current 155A, 155B to have a lateral component along the active orsuperlattice layers 1312. In an embodiment, the current 155A, 1556 canlaterally flow along quantum wells, which have a lower resistance thanbarrier layers.

As described herein, the interface described herein can be incorporatedinto any of various types of heterostructures/devices, including anemitting device such as a flip-chip LED shown in FIG. 1. It isunderstood that fabrication of the emitting device/heterostructure canbe performed using any solution. For example, fabrication of the device10 can include the deposition and removal of a temporary layer, such asmask layer, the patterning one or more layers, the formation of one ormore additional layers not shown, and/or the like.

In one embodiment, the invention provides a method of designing and/orfabricating a circuit that includes one or more of the devices designedand fabricated as described herein (e.g., including one or more contactsconfigured as described herein). To this extent, FIG. 16 shows anillustrative flow diagram for fabricating a circuit 126 according to anembodiment. Initially, a user can utilize a device design system 110 togenerate a device design 112 for a semiconductor device as describedherein. The device design 112 can comprise program code, which can beused by a device fabrication system 114 to generate a set of physicaldevices 116 according to the features defined by the device design 112.Similarly, the device design 112 can be provided to a circuit designsystem 120 (e.g., as an available component for use in circuits), whicha user can utilize to generate a circuit design 122 (e.g., by connectingone or more inputs and outputs to various devices included in acircuit). The circuit design 122 can comprise program code that includesa device designed as described herein. In any event, the circuit design122 and/or one or more physical devices 116 can be provided to a circuitfabrication system 124, which can generate a physical circuit 126according to the circuit design 122. The physical circuit 126 caninclude one or more devices 116 designed as described herein.

In another embodiment, the invention provides a device design system 110for designing and/or a device fabrication system 114 for fabricating asemiconductor device 116 as described herein. In this case, the system110, 114 can comprise a general purpose computing device, which isprogrammed to implement a method of designing and/or fabricating thesemiconductor device 116 as described herein. Similarly, an embodimentof the invention provides a circuit design system 120 for designingand/or a circuit fabrication system 124 for fabricating a circuit 126that includes at least one device 116 designed and/or fabricated asdescribed herein. In this case, the system 120, 124 can comprise ageneral purpose computing device, which is programmed to implement amethod of designing and/or fabricating the circuit 126 including atleast one semiconductor device 116 as described herein.

In still another embodiment, the invention provides a computer programfixed in at least one computer-readable medium, which when executed,enables a computer system to implement a method of designing and/orfabricating a semiconductor device as described herein. For example, thecomputer program can enable the device design system 110 to generate thedevice design 112 as described herein. To this extent, thecomputer-readable medium includes program code, which implements some orall of a process described herein when executed by the computer system.It is understood that the term “computer-readable medium” comprises oneor more of any type of tangible medium of expression, now known or laterdeveloped, from which a stored copy of the program code can beperceived, reproduced, or otherwise communicated by a computing device.

In another embodiment, the invention provides a method of providing acopy of program code, which implements some or all of a processdescribed herein when executed by a computer system. In this case, acomputer system can process a copy of the program code to generate andtransmit, for reception at a second, distinct location, a set of datasignals that has one or more of its characteristics set and/or changedin such a manner as to encode a copy of the program code in the set ofdata signals. Similarly, an embodiment of the invention provides amethod of acquiring a copy of program code that implements some or allof a process described herein, which includes a computer systemreceiving the set of data signals described herein, and translating theset of data signals into a copy of the computer program fixed in atleast one computer-readable medium. In either case, the set of datasignals can be transmitted/received using any type of communicationslink.

In still another embodiment, the invention provides a method ofgenerating a device design system 110 for designing and/or a devicefabrication system 114 for fabricating a semiconductor device asdescribed herein. In this case, a computer system can be obtained (e.g.,created, maintained, made available, etc.) and one or more componentsfor performing a process described herein can be obtained (e.g.,created, purchased, used, modified, etc.) and deployed to the computersystem. To this extent, the deployment can comprise one or more of: (1)installing program code on a computing device; (2) adding one or morecomputing and/or I/O devices to the computer system; (3) incorporatingand/or modifying the computer system to enable it to perform a processdescribed herein; and/or the like.

The foregoing description of various aspects of the invention has beenpresented for purposes of illustration and description. It is notintended to be exhaustive or to limit the invention to the precise formdisclosed, and obviously, many modifications and variations arepossible. Such modifications and variations that may be apparent to anindividual in the art are included within the scope of the invention asdefined by the accompanying claims.

What is claimed is:
 1. A device comprising: a first semiconductor layer;a contact to the first semiconductor layer; a second semiconductor layerlocated between the first semiconductor layer and the contact, wherein acomposition of the first semiconductor layer is laterally homogeneousand a composition of the second semiconductor layer is laterallyinhomogeneous, and wherein an interface between the second semiconductorlayer and the contact includes a first roughness profile having acharacteristic height of at least three nanometers and a characteristicwidth of at least 0.1 micron.
 2. The device of claim 1, furthercomprising a 2D gas at an interface between the first semiconductorlayer and the second semiconductor layer.
 3. The device of claim 1,further comprising a second roughness profile at an interface betweenthe first semiconductor layer and the second semiconductor layer.
 4. Thedevice of claim 3, wherein the first and second roughness profiles areperiodic.
 5. The device of claim 4, wherein the first and secondroughness profiles form a photonic crystal.
 6. The device of claim 1,further comprising an interlayer located between the secondsemiconductor layer and the contact, wherein the interlayer comprises aplurality of islands.
 7. The device of claim 6, further comprising aplurality of protrusions that extend from the interlayer into at leastthe second semiconductor layer.
 8. The device of claim 6, wherein theplurality of islands includes islands formed of at least one of: ametal, an oxide, a nitride, or graphene.
 9. The device of claim 6,wherein at least one of the plurality of protrusions includes a set ofsharp edges.
 10. The device of claim 1, wherein the first roughnessprofile is at least 10% different at a center location of the devicethan at an edge location of the device.
 11. A device comprising: a firstsemiconductor layer; a contact to the first semiconductor layer; asecond semiconductor layer located between the first semiconductor layerand the contact, wherein a composition of the first semiconductor layeris laterally homogeneous and a composition of the second semiconductorlayer is laterally inhomogeneous, wherein an interface between thesecond semiconductor layer and the contact includes a first roughnessprofile with a characteristic height and a characteristic width, whereinthe characteristic height is an average vertical distance betweenadjacent crests and valleys of the first roughness profile, and is atleast approximately three nanometers, and wherein the characteristicwidth is an average lateral distance between adjacent crests and valleysof the first roughness profile, and is within a range of approximately0.1 micron to approximately fifty microns.
 12. The device of claim 11,further comprising a 2D gas at an interface between the firstsemiconductor layer and the second semiconductor layer.
 13. The deviceof claim 11, further comprising a second roughness profile at aninterface between the first semiconductor layer and the secondsemiconductor layer.
 14. The device of claim 11, further comprising aninterlayer located between the second semiconductor layer and thecontact, wherein the interlayer comprises a plurality of islands. 15.The device of claim 14, wherein the plurality of islands includesislands formed of at least one of: a metal, an oxide, a nitride, orgraphene.
 16. The device of claim 14, further comprising a plurality ofprotrusions that extend from the interlayer into at least the secondsemiconductor layer.
 17. The device of claim 16, wherein at least one ofthe plurality of protrusions includes a set of sharp edges.
 18. Thedevice of claim 11, wherein the first roughness profile is at least 10%different at a center location of the device than at an edge location ofthe device.
 19. A method comprising: fabricating a device, the devicecomprising: a first semiconductor layer; a contact to the firstsemiconductor layer; a second semiconductor layer located between thefirst semiconductor layer and the contact, wherein a composition of thefirst semiconductor layer is laterally homogeneous and a composition ofthe second semiconductor layer is laterally inhomogeneous, wherein aninterface between the second semiconductor layer and the contactincludes a first roughness profile having a characteristic height of atleast three nanometers and a characteristic width of at least 0.1micron.
 20. The method of claim 19, wherein the fabricating includes:depositing an interlayer over the first and second semiconductor layers;patterning and annealing the interlayer, such that a plurality ofprotrusions extend from the interlayer into at least the secondsemiconductor layer; depositing a metallic layer over the interlayer;etching at least one of: the interlayer or the second semiconductorlayer using the metallic layer as a mask; and depositing a reflectivematerial into the etched regions.